Hanmi Taiwan, the local subsidiary of South Korea's Hanmi Semiconductor, reported explosive growth in the first quarter of 2025, generating 76% of its entire 2024 revenue in just...
Hanmi Semiconductor has secured a major supply agreement with Taiwan's ASE Technology Holding Co., marking another strategic win in its global expansion drive. Under the contract,...
The protracted dispute between Hanmi Semiconductor and SK Hynix regarding the supply of Thermo Compression Bonding (TCB) equipment has reached a resolution, with Hanmi Semiconductor...
South Korean chip giant SK Hynix has placed significant orders for thermal compression bonding (TCB) equipment with two domestic suppliers, Hanwha Semitech and Hanmi Semiconductor,...
A brewing conflict between SK Hynix and its long-time supplier, Hanmi Semiconductor, over thermal compression bonder (TC Bonder; TCB) equipment has intensified, potentially reshuffling...
The South Korean semiconductor industry is abuzz with intrigue as Hanmi Semiconductor's once-ironclad relationship with SK Hynix frays over the supply of thermal compression bonders...
South Korean media outlets have reported that Hanmi Semiconductor has received additional orders for thermo-compression bonding (TCB) equipment from Micron Technology. Some industry...
Recently, reports from South Korea claim that Micron is set to become a rising star in the HBM market, following Samsung Electronics and SK Hynix. Although Donald Trump's current...
SK Hynix's eight-year partnership with Hanmi Semiconductor is showing signs of strain after the memory chipmaker began sourcing thermal compression bonding machines from rival Hanwha...
Hanmi Semiconductor has reportedly informed SK Hynix of a planned price increase for its thermal compression bonding (TCB) equipment, marking the first price hike since the South...
Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...
SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT expected to lead in equipment orders. Hanmi is set for growth...
SK Hynix is set to diversify its supply chain for thermocompression bonding (TCB) equipment used in HBM manufacturing. The company acquired an order of 30 units of TCB machines from...
Hanmi Semiconductor's new plant has been operational for just over a month, and the company has started expanding further. They aim to accelerate the production capacity of High-Bandwidth...
In recent years, due to the development of the High Bandwidth Memory (HBM) market, the thermal compression (TC) bonder equipment produced by Hanmi Semiconductor has attracted attention...
